One plus 13 cracked back no power

We disassembled the device and found the board with severe impact damage and bent.

We did a thermal reading on the board and it’s looks like there is overheating of the UFS chip on power being applied.

There is a few different approaches we can take with this device to recover data.

Sometimes the boards can survive bends like this, but lose function like cellular, sound, camera ect but still be able to work enough to retrieve data.

Because of the thermal reading your board is giving , I’m inclined to believe we may be able to get data by repairing the BGA on the UFS chip, which would be $500 and would retrieve all data from the device if successful.

The other options is a complete board transplant, which unfortunately with the price of a donor board being so high right now, and the liabilities involved in sacrificing an expensive board just to check if data recovery is possible, it would likely be more than 1k or more for data recovery.

We wouldn’t be able to do that, but we can refer you to someone who may be able to and they can quote you for that more accurately if you wish to go that route.

Basically what it comes down to is that we can try the UFS repair, if it’s successful we charge $500 and you get all data , if unsuccessful we only charge the $45 diagnostics fee. I’ve done it before with bend board that just needed UFS repaired and successfully retrieved data so it’s worth a shot.